In a recent update to the Geekbench 6 benchmark suite, MediaTek’s upcoming Dimensity 8500 system‑on‑chip (SoC) has been evaluated, delivering single‑core and multi‑core scores that suggest it could raise the bar for mid‑range smartphones in 2026. The evaluation was completed on a development board that houses the chip, which bears the internal code name MT6899.
Benchmark Results and Architecture
The Geekbench 6 test produced a single‑core score of 1,709 and a multi‑core score of 6,532. These figures place the Dimensity 8500 well above many current mid‑range competitors, indicating that it can manage intensive multitasking and modern gaming workloads with ease. The octa‑core configuration comprises one “prime” core running at 3.40 GHz, three performance cores at 3.20 GHz, and four efficiency cores at 2.20 GHz. This mix is intended to balance raw speed with battery life. The graphics processor is the ARM Mali‑G720 MC8, which is capable of sustaining decent frame rates in demanding mobile games.
High‑Speed Stability Focus
MediaTek’s design prioritises single‑threaded performance by boosting the prime core to 3.40 GHz. This approach is aimed at ensuring that tasks such as launching applications or capturing high‑resolution photos feel instantaneous. The robust multi‑core performance also signals readiness for the more demanding software requirements expected in 2026, including on‑device artificial intelligence processing and complex image enhancement algorithms.
Devices Set to Feature the Chip
Two consumer devices are expected to incorporate the Dimensity 8500. The first is the Honor Power 2, model SER‑AN00, which reportedly will house a 10,080‑mAh battery and a 1.5‑K OLED display. The second is the POCO X8 Pro, likely to launch in early 2026 as the global version of the Redmi Turbo 5. The POCO X8 Pro is anticipated to pair the Dimensity 8500 with a 120‑Hz AMOLED screen and 100‑W fast charging capability. Both devices aim to deliver flagship‑grade performance within a mid‑range price segment.
Implications for the Mid‑Range Market
With the benchmark data now available, the Dimensity 8500 appears poised to narrow the performance gap between mid‑range and high‑end smartphones. As core component costs rise, a chip that can deliver high performance without requiring premium pricing may influence manufacturers’ strategy for affordable devices. The early benchmark results suggest that budget‑friendly smartphones could become more capable, meeting the increasing demands of software and media consumption expected in the coming years.
Next Steps and Expected Developments
MediaTek has not yet announced a formal launch date for the Dimensity 8500, but the inclusion of the chip in the Honor Power 2 and POCO X8 Pro indicates a planned release in 2026. Manufacturers are likely to begin finalizing device designs in the coming months, and more detailed specifications will probably emerge as the launch approaches. Consumers and industry analysts will be watching closely to see how the chip performs in real‑world usage and how it compares to rival SoCs from other vendors. As the mid‑range market continues to evolve, the Dimensity 8500 could set a new benchmark for performance and efficiency in cost‑effective smartphones.
